Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability - Hardcover

Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un; Ma, Hongtao

Hardcover

ISBN 10: 1461492653 ISBN 13: 9781461492658

Publisher: Springer, 2014

Synopsis

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

About this title

From the Back Cover:

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. 

In summary, this book:

•  Provides an up-to-date overview on lead-free soldering technologies
•   Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique
• Explores emerging technologies in lead-free soldering

Review:

From the book reviews:

“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)

About this edition

• Publisher: Springer
• Publication date: 2014
• ISBN 10: 1461492653
• ISBN 13: 9781461492658
• Binding: Hardcover
• Number of pages: 266