In Situ Process Diagnostics and Intelligent Materials Processing: Volume 502 (MRS Proceedings) - Softcover

Softcover

ISBN 10: 1107413567 ISBN 13: 9781107413566

Publisher: Cambridge University Press, 2014

Synopsis

This book, first published in 1998, focuses on the rapidly developing field of sensor technology for process monitoring and control during fabrication of advanced materials and structures. Research in sensor driven, closed-loop control of the fabrication process (i.e., process-state monitoring), as well as product-state (e.g., wafer-state) monitoring are discussed. Featured are process techniques that include chemical vapor deposition (CVD), metalorganic chemical vapor deposition (MOCVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), rapid thermal processing (RTP), reactive-ion and plasma etching, electron beam evaporation, pulsed laser deposition (PLD), and sputtering. Materials of interest include electronic and optical thin films such as semiconductors, epitaxial oxides, metals and dielectrics, as well as particles and nanostructured materials. Sensing techniques for monitoring variables such as temperature, composition, optical properties, film thickness and particle-size distribution are highlighted. Topics include: sensor technologies and semiconductor diagnostics; sensor technologies and thin-film diagnostics; in situ diagnostics of oxide film growth and processes and intelligent processing of electronic ceramics.

About this title

Book Description:

This book, first published in 1998, focuses on the rapidly developing field of sensor technology for process monitoring and control during fabrication of advanced materials and structures. Research in sensor driven, closed-loop control of the fabrication process (i.e., process-state monitoring), as well as product-state (e.g., wafer-state) monitoring are discussed.

About this edition

• Publisher: Cambridge University Press
• Publication date: 2014
• ISBN 10: 1107413567
• ISBN 13: 9781107413566
• Binding: Paperback
• Number of pages: 306
• Editor: Rosenthal Peter A., Duncan Walter M., Woollam John A.