From the Publisher:
A collection of contributions that is meant to provide an overview of the techniques being used or contemplated for packaging of optoelectronic devices. It includes both details of the nitty gritty of existing commercial packages as well as some blueprints for soon-to-be packages and even some more blue sky considerations relating to the more futuristic "what if" types of packages. It covers detector, semiconductor laser, and optical amplifier packaging, waveguide technologies, free-space interconnects, and hybrid technologies, and examines communication system interconnection structure and fiber-optic networks in telecommunications.
About the Author:
ALAN R. MICKELSON, PhD, is a faculty member of the Electrical andComputer Engineering Department of the University of Colorado,Boulder. His research area is primarily centered on integratedoptical devices for use in high-speed/microwave systems.
NAGESH R. BASAVANHALLY, PhD, is a member of the technical staff atLucent Technologies/Bell Laboratories. His research interests arein optomechanical design, packaging, and assembly-relatedactivities in electronic and optical interconnectiontechnologies.
YUNG-CHENG LEE, PhD, is an Associate Professor in the Department ofMechanical Engineering and the Associate Director of the NSF Centerfor Advanced Manufacturing and Packaging of Microwave, Optical, andDigital Electronics, University of Colorado, Boulder.
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